There hasn't been a whole lot of news recently about processor advancement, but Intel put out a press release during their semi-annual Developer Forum in San Francisco today. They made several announcements, one of which is that the Peryrn brand of chips - their first 45nm product - will be shipping in November.
In addition to that, the company's President and CEO Paul Otellini showed off the world's first 300mm wafer using 32nm process technology. This new chip will be available starting in 2009.
INTEL DEVELOPER FORUM, San Francisco, Sept. 18, 2007 – Intel Corporation President and CEO Paul Otellini today outlined new products, chip designs and manufacturing technologies that will enable the company to continue its quickened pace of product and technology leadership.
Speaking to industry leaders, developers and industry watchers at the Intel Developer Forum (IDF), Otellini showed the industry's first working chips built using 32 nanometer (nm) technology, with transistors so small that more than 4 million of them could fit on the period at the end of this sentence. Intel's 32nm process technology is on track to begin production in 2009.
Otellini also described the near-term advantages computer users will experience with Intel's upcoming 45nm family of Penryn processors, which are based on its revolutionary high-k metal gate transistor technology. The industry's first 45nm processors will be available from Intel in November. The company also demonstrated for the first time the next-generation chip architecture codenamed Nehalem, due out next year.
Keep your chin up; you'll be able to upgrade those Core 2 Duo's soon! This is on top of a recent Intel blog entry where Jerry Bautista contemplates the possibilities of games taking advantage of Intel's 80-core Processor; fun stuff.
